KerfAid Dicing Surfactant

KerfAid is a wafer-safe additive to DI water during the wafer-dicing process to dissipate ESD, decrease chipping and cracking, and improve wafer cleanliness.

KerfAid's modern, “high molecular weight” lubricant helps prevent swarf build-up and cool the wafer kerf. KerfAid lubrication reduces excessive loading on the saw blade to extend blade life.

A corrosion inhibitor is included in our ( '000 series).

*other packaging options available

KerfAid Dilution Ratios with and without Corrosion Inhibitors

Superior Cleaning

Diagram of how KerfAid works

Our multi-surfactant formula captures debris particles in a KerfAid micelle, suspends them in the fluid, and then washes them away from the wafer's surface.

KerfAid also forms a protective layer on the wafer's surface 1: preventing corrosion/oxidation and 2: preventing debris from contacting the wafer

The KerfAid blend also reduces surface tension, allowing the lubricant/coolant into the kerf.

KerfAid surfactants keeping the wafer clean

KerfAid Reduces Chipping and Cracking

1. Preventing Swarf Build-up: If not washed away, swarf can build up between the sawblade and the wafer causing issues of chipping and cracking.

2. Minimizing Blade Turbulence: Effective lubrication minimizes 'blade chatter' for a smoother cut.

3. Cooling the Blade: Prevents overheating that can weaken the blade.

Example of chipping with and without KerfAid

ESD Reduction

Probe

Stain

Example of bond pad staining with and without KerfAid

DI water is relatively non-conductive, which

allows the generation of electrostatic charge.

You can reduce ESD at the friction point with increased lubrication and increased conductivity.

KerfAid lubricants help prevent electrostatic discharge and bond pad staining reducing failures during the wire bonding process.

KerfAid has NO phosphates, chlorides, fluorides, or organic material.

KerfAid will NOT gunk surfactant feed lines.

Anti-Corrosion in KA '000 Series

Examples of Corrosion

For Long Run Times

A push to boost efficiency by increasing wafer size and reducing die size leads to longer dicing times and extended DI water immersion. This increases the opportunities for corrosion on bond pads.

To address this, Millice has provided the option to include a corrosion inhibitor in KerfAid (the '000 series).

Flexible Packaging Options

Our pricing strategy enhances efficiency at the manufacturing and shipping level, optimizing operations for improved cost-effectiveness and streamlined logistics.